temperature of each chip may not exceed 80°C, what is the maximum allowable power per chip? What is the maximum allowable power if a turbulence promoter is used to trip the boundary layer at the leading edge?

An array of 10 silicon chips, each of length L=10 mm on a side, is insulated on one surface and cooled on the opposite surface by atmospheric air in parallel flow with T​=24°C and u​=40m/s. When in use, the same electrical power is dissipated in each chip, maintaining a uniform heat flux over the entire cooled surface. If the temperature of each chip may not exceed 80°C, what is the maximum allowable power per chip? What is the maximum allowable power if a turbulence promoter is used to trip the boundary layer at the leading edge?

How useful was this post?

Click on a star to rate it!

Average rating 0 / 5. Vote count: 0

No votes so far! Be the first to rate this post.

We are sorry that this post was not useful for you!

Let us improve this post!

Tell us how we can improve this post?

Similar Posts