Fundamentals of Heat and Mass Transfer – Problem 1.15

A square isothermal chip is of width w = 5 mm on a side and is mounted in a substrate such that its side and back surfaces are well insulated, while the front surface is exposed to the flow of a coolant at T infinity = I5 degree C. From reliability considerations, the chip temperature…

A one-dimensional plane wall of thickness 2L=100mm experiences uniform thermal energy generation of q dot=1000 W/m3 and is convectively cooled at x=+/-50mm by an ambient fluid characterized by T infinity=20°C. If the steady-state temperature distribution within the wall is T(x)=a(L2-x2)+b where a=10 °C /m2 and b=30 °C, what is the thermal conductivity of the wall?…

An array of 10 silicon chips, each of length L=10 mm on a side, is insulated on one surface and cooled on the opposite surface by atmospheric air in parallel flow with T∞​=24°C and u∞​=40m/s. When in use, the same electrical power is dissipated in each chip, maintaining a uniform heat flux over the entire cooled surface….

Radioactive wastes are packed in a long, thin-walled cylindrical container. The wastes generate thermal energy nonuniformly according to the relation q = qo [1 – (r/ro)2], where q is the local rate of energy generation per unit volume, qo is a constant, and ro is the radius of the container. Steady-state conditions are maintained by…

Heat transfer is a branch of thermal engineering that deals with the production, utilization, transformation, and interchange of thermal energy caused by variations in temperature, leading to changes in temperature distribution. The field of transport phenomena explores the transfer of momentum, energy, and mass through conduction, convection, and radiation. Heat Transfer Background In the early…