Fundamentals of Heat and Mass Transfer Seventh Edition Problem -1.13

Consider the geometry of Problem 2.14 for the case where the thermal conductivity varies with temperature as k = ko + aT. where ko = 10W/m-K, a =-10-3 W/m-K2, and T is in kelvins. The gradient at surface B is partial differential T/partial differential x = 30 K/m. What is partial differential T/partial differential y at…

An array of 10 silicon chips, each of length L=10 mm on a side, is insulated on one surface and cooled on the opposite surface by atmospheric air in parallel flow with T∞​=24°C and u∞​=40m/s. When in use, the same electrical power is dissipated in each chip, maintaining a uniform heat flux over the entire cooled surface….

Chips of width L = 15 mm on a side are mounted to a substrate that is installed in an enclosure whose walls and air are maintained at a temperature of Tsur =T=25C. The chips have an emissivity of ε = 0.60 and a max allowable temperature of Ts = 85 C. (a) If heat…

The 5-mm-thick bottom of a 200-mm-diameter pan may be made from aluminum (k = 240 W/m·K.) or copper (k = 390 W/m·K.). When used to boil water, the surface of the bottom exposed to the water is nominally at 110 °C. If heat is transferred from the stove to the pan at a rate of…

A square isothermal chip is of width w = 5 mm on a side and is mounted in a substrate such that its side and back surfaces are well insulated, while the front surface is exposed to the flow of a coolant at T infinity = I5 degree C. From reliability considerations, the chip temperature…

Abstract The purpose of this lab was to determine the thermal conductivity k of the disk material by measuring the temperature distribution for transient and steady-state heat conduction in a cylindrical wall. To conduct this experiment cooling water was pumped though the HT10X Heat Transfer service Unit at approximately 1.5 liters/min. Initially the heating power…